The IEEE Sensors Council sponsored the Global MEMS Multi-Project Wafer (MPW) Run Training Programme in collaboration with the IEEE Electronics Packaging Society (EPS), IEEE MEMS Technical Committee (MEMS TC), and the Institute of Smart Structures and Systems (ISSS). The programme attracted over 500 participants worldwide, many of whom collaborated in teams to design and submit MEMS devices for fabrication.
These devices are currently being fabricated at the Centre for Nano Science and Engineering (CeNSE), Indian Institute of Science (IISc), India. This event will provide participants and the broader scientific community with an opportunity to showcase the fabricated devices, present the results obtained, and discuss key technical insights from the work.
The CeNSE fabrication team will share an overview of the complete journey, from training and device design through fabrication and characterization. In addition, selected participants and mentors involved in the programme will present their work, share their experiences, and highlight the outcomes and impact of their projects.
The objective of this event is to engage a broader scientific audience and encourage greater participation in future editions of the training programme. As the IEEE Sensors Council remains committed to supporting this initiative, the event will demonstrate the value of hands-on, fabless MEMS device development and provide insights into the opportunities available through the programme.
All researchers, students, Industry personnel and practitioners are encouraged to attend, learn from the experiences of current participants, and gain valuable knowledge in MEMS design, fabrication, and characterization. The event offers a unique opportunity to understand the complete fabless device development process and benefit from the expertise of leading researchers and industry professionals.
